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Development Status of Optical Communication Module
2020/10/29 03:10:25

In recent years, with the development of 5G market, the demand for optical communication modules has also increased. EXSENSE Electronics Technology Co., Ltd. has focused on the research, development and production of NTC thermistor chip for optical communication module for more than 13 years. The thermistor chip of our company has characteristics of high precision, high sensitivity, which can better play the role of temperature monitoring and temperature control in optical communication module.

According to the latest research of Yole Development, the global market size of optical communication module will grow from 7.7 billion US dollars in 2019 to 17.7 billion US dollars in 2025, with a compound annual growth rate of 15%. Among them, the size of telecommunications market will grow from 3.7 billion US dollars to 5.6 billion US dollars at a compound growth rate of 7%, and the digital communications market will grow from 4 billion US dollars to 12.1 billion US dollars at a compound growth rate of 20%, and the proportion of digital communications module will further increase.

With the continuous increase of data volume and the update of equipment stock, the market demand for optical communication module increases sharply, and the market size of electric chip also grows accordingly. Optical chip is the core of photoelectric conversion in optical communication module. The global market size is about 600 ~ 700 million US dollars. It is expected that in the next 3-5 years, with the acceleration of data center construction and 5G construction entering the hot phase, the compound growth rate of market size will exceed 10%.

Optical chip can be divided into VCSEL (Vertical Cavity Surface Laser), DFB (Distribute Feedback Laser) and EML (Electroabsorption Modulated Laser). At present, 10G optical chips are basically localized, and 25G and above high-speed optical chips are mainly occupied by foreign manufacturers. Domestic manufacturers still have a one-generation or two-generation technology gap with foreign ones in high-speed TIA, CDR and DSP products, the localization rate is extremely low. In recent years, domestic manufacturers have started to enter the market, which are expected to realize the localization of high-speed optical chips in recent years.

At present, in the optical communication module market, the market share of domestic manufacturers is gradually increasing. On the whole, domestic optical module manufacturers have a strong demand for the localization of high-rate optical chips. Several representative domestic enterprises have had strong cost advantages and packaging technology advantages, occupying 60-80% of the global market share.

In the optical communication module, the technological breakthrough of upstream optical and electric chips is the main development direction in the future. As a whole, the upstream optical chips and electric chips are located at the core of the optical communication industry chain, with high technical barriers and high product value. Although domestic manufacturers have gradually increased the overall market share in the optical communication market, they are still mainly composed of optical module encapsulation. In the field of upstream core components optical chips and electric chips, there is a big gap with the international level. Only a small number of domestic enterprises have certain mass production capacity of optical chips and electric chips.

Reference Data:

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