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DR Series - Bonding Gate Resistor
DR Series bonding gate resistor is a new product independently developed and produced by EXSENSE Electronics Technology Co., LTD. At present, there are two types of horizontal conduction and vertical conduction products, which are suitable for IGBT, SiC, GaN power modules and other bonding applications.
1. Bonding
2. Silver Sintering
3. Withstand high-temperature long time soldering
4. Great weatherability
5. Operating temperature: -55~175℃

1. IGBT module, SiC module, GaN module, etc.
2. Other fields of bonding application
Part Number Identification
Electronic Parameter Specification

Rated Power (W)

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