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DT Series -- High Precision Die (bare chip) NTC Thermistor
FEATURES
DT series NTC thermistor is the newest development in chip NTC thermistors. The miniature package is designed for hybrid applications where bonding wire or Au/Sn solder is used as the attachment method. The terminations on the top and bottom of the thermistor are gold (Au) plated for the ultimate in hybrid designs and construction.
1、Adopt gold electronide,higher realiabilty,gold/aluminum/silver wire bonding.
2、High accuracy,can reach ±0.3%,±1%,±3%.
3、High stability& reliabilty.
4、Small size,can be 0.3*0.3mm.
5、Fast response.
6、Customized sizes and parameters are avaliable.
APPLICATION
1、Bonding( infrared thermal reactor,IGBT,Thermal printer head,Integrate module,semiconductor module,power mould etc).
2、Hybrid designs and construction.
3、High Precision NTC Temperature sensor.
Part Number Identification
Electronic Parameter Specification
Part No. R25℃(KΩ) B(K)

Regular Size (mm)

L*W*T

Rated Power@25(mW)

(@25±0.5 in the still air)

Dissipation factor(δ)(mW/)

(T=25 in the still air

Thermal time 

constant (s)

DT502□3950A 5.0  3950 1.0*1.0*0.5 60mW  1.2 ≤3
DT103□3435B 10.0  3435 0.95*0.95*0.6 60mW  1.2 ≤3
DT103□3470A 10.0  3470 1.0*1.0*0.5 60mW 1.2 ≤3
DT103□3950A 10.0  3950 1.1*1.1*0.46 60mW  1.2 ≤3
DT203□3743A 20.0  3743 1.1*1.1*0.6 60mW  1.2 ≤3
DT303□3950A 30.0  3950 1.0*1.0*0.55 60mW 1.2 ≤3
DT473□4050A 47.0  4050 0.45*0.45*0.25 10mW  0.2 ≤2
DT503□3950A 50.0  3950 1.0*1.0*0.55 60mW  1.2 ≤3
DT104□3950A 100.0  3950 0.95*0.95*0.6 60mW  1.2 ≤3
DT104□3964F 100.0  3964 0.45*0.45*0.2 10mW 0.2 ≤2
DT104□4100A 100.0  4100 0.95*0.95*0.6 60mW  1.2 ≤3


In addition to the above dimensions and conventional resistance values, we can do the following range of products:

Resistance: 1kΩ ~ 1000kΩ
B value: 3200K ~ 4500K
Size: 0.3mm ~ 4.0mm



Package
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