Resistance Value: R25=5KΩ±5%
B Value: B25/50=3375K±5%
Thermal time constant: ≤20s (In still air)
Dissipation Factor: ≤2.5mW/℃ (In still air)
Operating temperature range: -40~+250℃
Reliability Test
Item |
Standard |
Test method |
Temperature cycle |
∣△R25∣≦ 3% Appearance without damage |
-50℃/15min→Room Temp./3min→200℃/15min 1000 cycles |
High temperature load test |
charge 0.2mA for 1000 ± 24 hrs at 100±5℃ |
|
High temperature storage test |
200±5℃ in air for 1000 ± 24hrs |
|
Low temperature storage test |
-50±5℃ in air for 1000 ± 24hrs |
|
Moisture resistance test |
85±2℃ in 80%~90%RH environment for 1000± 24hrs。 |
|
Resistance to solder heat |
Solder Temperature: 350±5℃ Dipping Time: 10±1 sec |
|
Weldability Test |
Welding coverage≧95% |
Soldering Temp.:235±5℃ Time of dipping tin:2±0.5sec |
Lead bending test |
Appearance without damage |
Secure at 3MM of lead outlet, add 4.9N weight, bend 90°and return to original position. Repeat twice. |
Lead tension test |
Add 9.8N tension to the lead in axial direction and hold for 30S. |