Item

Standard

Test method

Temperature cycle

∣△R25∣≦ 3%

Appearance without damage

-50℃/15min→Room Temp./3min→200℃/15min 1000 cycles

High temperature load test

charge 0.2mA for 1000 ± 24 hrs at 100±5℃

High temperature storage test

200±5℃ in air for 1000 ± 24hrs

Low temperature storage test

－50±5℃ in air for 1000 ± 24hrs

Moisture resistance test

85±2℃ in 80%～90%RH environment for 1000± 24hrs。

Resistance to

solder heat

Solder Temperature: 350±5℃

Dipping Time: 10±1 sec

Weldability Test

Welding coverage≧95%

Soldering Temp.：235±5℃

Time of dipping tin：2±0.5sec

Lead bending test

Appearance without damage

Secure at 3MM of lead outlet, add 4.9N weight,

bend 90°and return to original position. Repeat twice.

Lead tension test

Add 9.8N tension to the lead in axial direction and hold for 30S.