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Welcome to EXSENSE Electronics Technology Co.,Ltd.

EXSENSE customizes silver / gold electrode NTC chip die, high precision / high temperature NTC thermistor & waterproof / fast response temperature sensor. Application: new energy vehicles / smart home / GSM / OA / medical electronic, infrared thermal / thermal printer head / laser printer & copier / IGBT / optical communication devices / smart toilet / coffee maker / medical device.
    EXSENSE Electronics Technology Co.,Ltd.is specialized in a variety of NTC thermistor NTC temperature sensor devices and related materials research, production, development and sale of private high-tech enterprises.Companies in the industry rely on a strong collaborative capabilities, to provide customers with a variety of electronic components supporting services.
    The use of advanced semiconductor manufacturing process combined with independent intellectual property rights of the NTC temperature sensor, NTC thermistor materials and process technology, through Japan, Taiwan, Germany, imported high-precision materials processing, slicing, packaging and testing equipment, we achieved an NTC thermistor NTC resistor temperature sensor devices and high-precision volume manufacturing. At the same time, through innovative management, strengthening quality control, we ensure the continuous production of products with high stability, high reliability. At this stage of the main species produced include: AT Series-- High Precision Dip NTC ThermistorLT Series-Small Size High Precision Dip NTC Thermistor BT Series–Battery Series High Precision NTC ThermistorDT Series—Die (Bare chip)NTC ThermistorIT Series—Electronic Thermometer Series High Precision NTC ThermistorCT Series–Chip Type NTC ThermistorFT Series–Film Type NTC ThermistorGT Series–Glass Sealed NTC ThermistorPT Series–Power Type NTC ThermistorTS Series–NTC Temperature sensor
    The Company in the NTC temperature sensor, NTC thermistors, temperature sensitive components and materials have a number of innovative and independent intellectual property rights, we have continued to strengthen its own R & D capability has been maintained at the same time with the advanced international counterparts in the field close cooperation, and strive to provide customers with the most advanced technology of international standard products and the most internationally competitive quality and service!
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  We always focus on NTC thermistor & temperature sensor.
 
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Know More IGBT Internal Structure With NTC Thermistor Chip


Know More IGBT Internal Structure With NTC Thermistor Chip

IGBT module mainly consists of several hybrid IGBT chips, and the electrical connections are realized through aluminum wires.In the standard IGBT encapsulation, a single IGBT will also have a continuation diode, followed by a large amount of silicon gel over the chip, and finally wrapped in a plastic shell, the IGBT unit stack structure as below.

It is made up of chips, DBC, and metal cooling plates (usually Copper) from top and down .DBC consists of three layers of material the upper and lower layers are metal layers, and the middle layer is insulating ceramic layer.DBC has a better performance than ceramic substrate: it has lighter weight, better thermal conductivity and better reliability.

In the usual power cycle or temperature cycle, the chip, the solder layer, the substrate, the bottom plate and the package shell will experience the temperature and temperature gradient of different layers.Coefficient of Thermal Expansion (CTE, Coefficient of Thermal Expansion) is an important performance index of the materials, refers to in a certain temperature range temperature rise per 1 degree, to the line size of the increase in the ratio of the length of the 0 degrees.
Blow structure is commonly used in thermal expansion coefficient.

Due to the different thermal expansion coefficients of each materials, thermal strain between the temperature changes of different material, mutual connection layer between the joint produces due to thermal stress fatigue wear and tear.Therefore, the thermal behavior of devices is closely related to the structure of module encapsulation.
Research shows that working temperature every 10 ℃, caused by a temperature failure rate doubled.

In IGBT module, there is NTC thermistor chip components to control the temperature.
Due to the thermal expansion coefficients material has a relative with temperature.
So NTC thermistor chip is a key of IGBT Module, the characteristic is high accuracy and high stability. And the size also can be 0.3*0.3mm.
Exsense Company manufacture NTC thermistor chip of DT series for 10 years, we can customized sizes and parameter are available. We also have UL certifications for this NTC thermistor chip.

EXSENSE Electronics Technology Co., Ltd.
 

E-mail: sales9@exsense.com.cn
Tel: +86-758-2287899
Fax: +86-758-6620336 / 6198980
Claim email: export@exsense.com.cn
Factory Address: Tangxia Industry Zone, Mugang Town, Duanzhou District, Zhaoqing City, Guangdong Province, China
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