With the rapid development of electric vehicles and hybrid vehicles, SiC silicon carbide modules as one of their core components, how to effectively improve performance and optimize efficiency has become a research hotspot. As a key component in the SiC silicon carbide module, the DR series bonding gate resistor developed and produced by EXSENSE Electronics Technology Co., Ltd. assists it in innovating and maintaining market competitiveness.

The two encapsulating methods of the bonding gate resistor (horizontal conduction and vertical conduction) can cater to the different installation layouts of SiC modules and improve the level of integration. And the bonding gate resistor:

First, high accuracy: In order to ensure the efficient power conversion of the silicon carbide module, the high accuracy of the gate resistor is used to maximize its performance and improve the operation accuracy;

Second, the temperature coefficient of resistance (TCR) is low, when the silicon carbide module is in the application scenario of large ambient temperature difference, the bonding gate resistor can also maintain stable operation, reducing the impact of temperature fluctuation on the module;

Third, excellent reliability, the characteristics of low aging drift rate of gate resistor can stabilize the efficiency of the SiC module and help extend its service life.

In addition, the bonding gate resistor mass-produced by EXSENSE Electronics can use silver sintering and bonding process in the encapsulating process of silicon carbide modules, and can withstand long-term high-temperature soldering to improve module performance and production flexibility. Silicon carbide modules' efficient power conversion, stable power management, and excellent thermal management capabilities are critical to improving a vehicle's range, acceleration, and overall reliability. Therefore, in addition to balancing the current in the design circuit of the silicon carbide module chip in parallel, the bonding gate resistor will also combine with other components to ensure the normal operation of the module, improve its switching characteristics, reduce losses, and enhance anti-interference ability.