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Manufacture of Ceramic Chip Capacitor
2019/09/10 02:09:19



In electronic circuits, chip capacitor is used to block direct current through alternating current, as well as to store and release charges to act as filter to smooth output pulsating signal. The chip capacitance produced by EXSENSE Electronic Technology Co., Ltd. production, with the advantages of small size, thin thickness (thickness is generally 0.15~0.5mm), low loss, etc., different sizes and parameters can be customized according to customers' requirements.

Today, let’s introduce a manufacturing method of ceramic chip capacitor. In this way, the capacitance per unit area is increased and the ceramic dielectric layer is thinner, up to about 0.0005 inches. Compared with chip capacitors of similar size in similar technologies, capacitors produced by this method have higher temperature characteristics and lower losses.


Preparation of the Electrode Precursor

Blend 52 parts by weight of fine (1 micron) platinum powder and 22pbw Ferro Corp. (Penn Yan, N.Y.) dielectric powder X5000 into 26pbw of a saturated solution of ethyl cellulose in kerosene.


Preparation of the “Green” Dielectric Tape

Mix the following ingredients in a 1000 cc porcelain mill jar with 500 cc of 1/4-inch porcelain cylinders:

96g Air Products (Allentown, Pa.) AirVol 21-205 polyvinyl alcohol

6.6g Triethylene Glycol

0.6g Air Products Dynol 604 surfactant

1.2g Glacial Acetic Acid

150g Ferro Corp. X5000 dielectric powder

46.5g distilled water

Roll mixture for 48 hours at 100 rpm.


Discharge mixture (“slip”) and cast as follows:

1. Put container with slip into vacuum chamber. Close chamber and turn pump on. Adjust for vacuum of 27±1 inches of Hg. Deair (operate pump) for 30 minutes.

2. Set the Doctor Blade to 0.001 and cast on polypropylene film at a rate of 0.75 inch/second. Allow to dry.

3. Peel cast tape from film.

Manufacture of Capacitors

1. Cut green tape into 2 inch by 2 inch Sections.

2. Stencil previously prepared electrode precursor onto 2x2 section, completely covering one surface with a 0.004inch thick layer of electrode precursor.

3. Dry in oven at 80℃ for 4 hours.

4. Fire in programmable furnace as follows:

a. Bring temperature from room temperature to 2375 degrees F. at 2 degrees F. per minute.

b. Hold for 2 hours at 2375 degrees F.

c. Turn heat off and allow to cool to room temperature in closed furnace.

5. Sputter each side with metal as follows:

a. 10 micro inch titanium-tungsten

b. 30 micro inch nickel

c. 80 micro inch gold

6. Chip capacitor is diced according to the specified chip size.






Reference Data:


SINGLE LAYER ELECTRONIC CAPACTORS WITH VERY THIN DIELECTRICS AND METHODS TO PRODUCE SAME

US 6, 690, 572 B2

Inventor: Larry A. Liebowitz, 129 Adirondack

Ave. Spotswood, NJ (US) 08884


Notice: Subject to any disclaimer, the term of patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.


Appl. No.: 10/090, 816

Filed: Mar. 6, 2002

Prior Publication Data

US 2003/0169555 A1 Sep. 11, 2003

Int. Cl.7 ............................. H01G 4/06; H01G 4/00

U.S. Cl. ............................. 361/311; 361/303

Field of search ............................. 361 /301.4, 303-305, 361/311-313, 320, 321.1-321.5


References Cited

U.S. PATENT DOCUMENTS

3, 689, 810 A * 9/1972  Walles ........................ 361/305

3, 882, 059 A * 5/1975  Elderbaum ................. 29/25.42

5, 254, 360 A *10/1993  Crownover et al. .......... 427/79

5, 737, 180 A * 4/1998  Yoo ............................. 361/313

6, 207, 522 B1 * 3/2001 Hunt et al. .................... 438/393

6, 366, 443 B1 4/2002 Devoe et al. ..................... 361/313

6, 433, 993 B1 * 8/2002 Hunt et al. ..................... 361/303


FOREIGN PATENT DOCUMENTS


P-2000-327964 A * 11/2000

cited by examiner

Primary Examiner - Dean A. Reichard

Assistant Examiner - Eric Thomas

Attorney, Agent or Firm - Leonard Cooper


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