SLC Single layer capacitor produced by EXSENSE Electronics Technology Co., Ltd. has the advantages of small size, thin thickness, low equivalent series resistance, low loss, etc., its application frequency can up to several GHz, which is suitable for small, microwave occasions and can be used in microwave integrated circuits, plays the role of blocking, RF bypass, filtering, tuning and other functions.

The dielectric ceramic substrate of SLC single layer capacitor is made of ceramic green body densified by sintering at high temperature. During sintering, the ceramic green body will shrink, and the shrinkage rate can reach 17%~20%. The shrinkage stress in the sintering process will make the substrate war-page, resulting in subsequent processing such as electrode coating, secondary slicing, etc., can not be carried out, so that the product defect rate increases. In order to obtain the single layer capacitor with high flatness and great electrical performance, it is necessary to have a set of process flow to improve the yield, the specific steps are as follows:

First, the ceramic powder and adhesive, solvent are mixed to prepare ceramic slurry, the ceramic slurry is taped casting and dried to obtain the ceramic film;

Second, according to the designed thickness to stack ceramic film to form a thick film and use isostatic pressing machine to pressed it, then cut it according to a certain size to get a square substrate green body;

Third, the substrate green body sintered at high temperature to form a ceramic substrate;

Fourth, the metal electrode is sputtered on the substrate and the substrate is diced to obtain the single layer capacitor.

Among them, the process of stacking and sintering of substrate green body is to prepare multiple substrate green bodies and multiple zirconia films, and several green bodies and zirconia films are stacked alternately and placed on zirconia film for sintering. Substrate green bodies and zirconia films stacked naturally, no bond between each other, during sintering substrate green bodies can shrink freely. The shrinkage stress is not superimposed and the stress is small, and the zirconia film will not inhibit the shrinkage of the substrate green bodies, so the substrate is flat without crack, and the zirconia film is easy to separate from the substrate. The ceramic substrate with high flatness and great electrical performance can be prepared by this sintering method, which reaches the shrinkage temperature and slowly rises to the highest sintering temperature at the rate of 2℃/min. The SLC single layer capacitor has concentrated capacitance, low loss and good insulation performance.