High power NTC thermal gold electrodes chip/ silver electrode chip encapsulation technology and its development

Article

High power NTC thermal gold electrodes chip / silver electrode wafer packaging the structure and process complex, and directly affect NTC thermal gold electrodes chip / silver electrode chip performance characteristics and life, has been in the world, especially high power white light NTC thermal gold electrodes chip/silver electrode chip encapsulation is the hot research hot spots. NTC thermal gold electrodes / silver electrode chip encapsulates the function mainly includes:

1. Mechanical protection to improve reliability;

2. Strengthen heat dissipation, in order to reduce chip junction temperature, improve thermal NTC gold electrodes chip/silver electrode chip performance;

3. Optical control and improve the efficiency of light, optimize beam distribution;

4. The power supply management, including communication/dc shift, and power control, etc.

NTC thermal gold electrodes  / silver electrode chip packages methods, materials, structure and the choice of technology mainly by chip structure, photoelectricity/mechanical properties, application and cost factors.

After 40 years of development, NTC thermal gold electrodes chip/silver electrode wafer packaging has gone through the scaffolding (Lamp NTC thermal gold electrodes chip/ silver electrode chips) and SMD type (SMD NTC thermal gold electrodes chip/silver electrode chip), Power type heat-sensitive NTC gold electrodes chip/silver electrode chips (Power NTC thermal gold electrodes chip/silver electrode chip) stage of development.

With the increasing of power chips, especially solid-state lighting the needs of the development of the technology of NTC thermal gold electrodes chip/silver electrode chip encapsulates the optical, heat, electrical and mechanical structure, put forward a new and higher requirements. In order to effectively reduce encapsulation thermal resistance and improve the efficiency of light, must use new technology thinking to encapsulate design.