As the core power component of the electric control system in electric vehicle, automotive-grade IGBT module has a junction temperature that directly affects the safety of the vehicle and system reliability. IGBT can reach high junction temperatures during switching and overload conditions. If the temperature exceeds the safe threshold and protective measures aren’t taken in time, it can lead to chip failure or even module burnout. Currently, it’s common in the industry to integrate EXSENSE MELF glass-encapsulated NTC thermistor inside the IGBT module for real-time temperature monitoring, helping the automotive-grade IGBT with conduction and switching while reducing the risk of thermal runaway.

In the packaging structure of automotive-grade IGBT module, EXSENSE MELF glass-encapsulated NTC thermistor is usually installed on the DBC substrate inside the module, close to the IGBT chip and diode chip. The heat generated by the IGBT chip during operation is conducted through the inner substrate, and placing the NTC directly on the inner substrate minimizes thermal resistance during heat transfer. This allows the NTC thermistor to quickly and accurately detect the temperature changes of the chip, providing reliable data for subsequent temperature monitoring and control measures.

In automotive-grade IGBT module, EXSENSE MELF glass-encapsulated NTC thermistor plays a key role in sensing temperature. Its measurements are the core basis for module thermal management and over-temperature protection strategies, the excellent electrical performances of NTC are indispensable in this process:

1. High-temperature resistance to handle complex conditions

During high-speed driving or frequent acceleration/deceleration in electric vehicle, IGBT module experiences intense operation, and temperatures can quickly rise to 150℃ or even higher. The glass-encapsulated structure of EXSENSE MELF thermistor allows it to remain stable in high-temperature IGBT operating environments without performance drift or damage, ensuring accurate temperature monitoring of the IGBT module.

2. Excellent sensitivity with quick response to temperature changes

MELF chip glass-encapsulated NTC thermistor reacts quickly, capturing transient temperature changes of the IGBT in real time and sending the signals through connected circuits to the control system. This allows the system to trigger warnings or take control measures in advance, preventing thermal damage caused by temperature monitoring delays and reducing the risk of IGBT failure due to temperature shocks.

3. Leadless design for highly integrated applications

Automotive-grade IGBT module is trending toward high-density integration, with higher demands on the structure and size of internal components. The leadlesas design of EXSENSE MELF glass-encapsulated NTC thermistor facilitates automated SMT, allowing it to be closely arranged with other power components in the limited space of the IGBT, achieving more efficient temperature monitoring and thermal management.