As the core power switching device in power electronics system, the thermal management of IGBT module is directly related to the safety and reliability of the system. To prevent the junction temperature of the IGBT module from becoming too high, which could lead to performance degradation or even damage, EXSENSE glass-encapsulated NTC thermistor is integrated inside for temperature monitoring, ensuring the module operates smoothly.
Considering that the reducing atmosphere in the reflow soldering process after IGBT module packaging may affect the performance of the glass-encapsulated NTC, EXSENSE Electronics recommends using self-developed and mass-produced solderable excellent-reliability NTC chip:
1. Resistance to acidic/reductive atmospheres: EXSENSE solderable bare chip adds a protective layer on the basis of conventional NTC chip, which effectively isolates the NTC from substances such as formic acid, hydrogen, nitrogen, etc. This feature ensures the stable operation of the solderable excellent-reliability NTC chip in complex soldering environments, providing strong support for the efficient operation of IGBT module.
2. Strong installation adaptability: EXSENSE solderable excellent-reliability NTC chip can be installed using various methods, including eutectic soldering, silver paste, various reflow soldering processes, silver sintering, bonding,etc., meeting the installation requirements of IGBT modules in different application scenarios and process conditions.
3. Fast response speed: The bare-chip structure of EXSENSE solderable NTC makes it more sensitive. During the process of temperature acquisition, its thermal response constant is smaller than that of traditional NTCs, helping the system issue protective commands more quickly when the junction temperature is abnormal and taking timely measures to keep the IGBT junction temperature within a safe range.
With high-accuracy temperature monitoring capability, EXSENSE solderable excellent-reliability NTC chip provides real-time feedback on IGBT module temperature changes, offering crucial data support for temperature control. Its resistance to reductive atmospheres improves the technical difficulties of NTC being prone to corrosion and resistance value drift during IGBT module production, ensuring accurate and stable temperature monitoring during use. The strong installation adaptability allows solderable bare chip to meet the installation requirements of various IGBT modules, improving production flexibility and efficiency while reducing production costs. The fast response of the solderable NTC chip can detect temperature anomalies in real time and promptly output warning signals to assist the control system in reducing thermal shocks, enabling IGBT modules to maintain excellent operating conditions under high-frequency, high-load conditions. In fields such as new energy vehicle and data center, the temperature monitoring of IGBT module relies on EXSENSE solderable excellent-reliability NTC chip. It provides a solid foundation for the stable operation of power electronics system in these areas and are indispensable components for achieving efficient and reliable operation of IGBT module.
