The switching action of the IGBT module during operation will produce switching and on-state losses, which will be converted into heat and cause its temperature to rise sharply. In order to prevent IGBT damage caused by abnormal junction temperature, EXSENSE MELF glass encapsulated NTC thermistor is placed in IGBT module of most design solutions to accurately monitor the operating temperature of it, which is the key to ensuring its stable operation.

As the "energy conversion control center" in the field of power electronics, the IGBT module undertakes the key task of converting DC power into AC power in the motor control system of EV. In a photovoltaic inverter, it is responsible for converting the direct current generated by the solar cells into alternating current and integrating it into the grid. During the above-mentioned operation of the IGBT module, the EXSENSE thermistor monitors its real-time junction temperature, and when the IGBT temperature changes, the NTC resistance value changes exponentially. The voltage divider circuit then converts the resistance value into a voltage signal output, which can then reflect the operating temperature of the IGBT chip, providing reliable data for over-temperature protection and temperature monitoring.

At present, the mainstream installation method of EXSENSE MELF glass encapsulated NTC thermistor is mainly built-in installation, which directly fixes the NTC on the DCE heat dissipation substrate of the IGBT chip through the soldering process, which minimizes the thermal resistance during the heat transfer process. This installation method enables the NTC thermistor can quickly and accurately sense the temperature change of the chip and reduce the temperature measurement delay. EXSENSE MELF glass encapsulated NTC thermistor mainly relies on its own superior characteristics to help IGBT module work efficiently:

1. Fast response, quickly capture temperature dynamic changes

The instantaneous temperature rise generated by the switching action of IGBT module is often very rapid and difficult to capture. The excellent sensitivity of EXSENSE thermistor enables it to respond to the temperature in a short time, allowing the system to trigger the early warning mechanism or adopt corresponding control strategies in advance, thus avoiding thermal damage to the IGBT module caused by the lag in temperature monitoring.

2. Leadless, suitable for high-density integrated design

With the rapid development of power electronics technology, IGBT module is evolving towards high-density integration, which puts forward more stringent requirements for the structure and size of internal components. Leadless encapsulation for NTC thermistor, not only significantly reduces parasitic inductance, lower interference and loss during signal transmission, but also greatly saves installation space, making it easier to embed NTC thermistor inside IGBT module and highly integrated with other components.

3. Small dimension: optimize the allocation of module space resources

The compact size of EXSENSE MELF glass encapsulated NTC eliminates the need to occupy the current-carrying area of the IGBT chip during installation, avoiding the problem of degradation of module current-carrying capacity due to component installation. This not only helps to increase the power density of IGBT module, but also enables installation closer to the heat source, reducing heat conduction paths, improving the accuracy and responsiveness of temperature monitoring.

In the thermal management system of IGBT module, EXSENSE MELF glass encapsulated NTC thermistor is like keen "eye", providing a favorable basis for the dynamic thermal management of the system. The IGBT control system can implement effective temperature management strategies through real-time temperature data obtained by EXSENSE MELF glass encapsulated NTC thermistor, keeping the junction temperature of the IGBT module within the optimal range, which is neither too high than causing damage or too low affecting efficiency.