When the IPM module is running, its carrying current will generate a large amount of heat, and excessive junction temperature can easily lead to deterioration of IPM internal components, reduced reliability, and even thermal runaway and module damage. Therefore, accurate temperature monitoring and reliable temperature protection are key to ensuring the stable operation of the IPM module. With its unique temperature characteristics, EXSENSE silver termination NTC chip effectively ensures that the junction temperature of the IPM module is maintained within the appropriate range, making it an ideal choice for temperature monitoring and over-temperature protection.
In order to ensure the working accuracy and timeliness of the EXSENSE silver termination NTC chip, the NTC will be arranged close to the power chip in the IPM module design scheme. Normally, NTC chip is installed on insulating substrate. As the substrate is the main heat dissipation carrier of IPM internal components, and its temperature changes can directly reflect the operating temperature rise of IGBT and FRD. EXSENSE bare chip can more accurately capture temperature anomalies and further shorten the temperature response time. When the NTC chip detects that the temperature exceeds the threshold set by the IPM module, the protection circuit will turn off the gate drive signal and cut off the power output to avoid overheating damage. When the temperature drops to a safe temperature range, the drive signal will be restored and the module will re-enter the working state. This protection measures make up for the lag of overheating protection action of the IPM module, realize overheating protection, and highlight the irreplaceability of EXSENSE silver termination NTC chip in IPM module. This depends on:
1. High sensitivity, monitoring minute temperature changes of IPM module
Compared with other temperature sensing components, the EXSENSE bare chip has faster thermal response time and can quickly capture local temperature rises inside the IPM module caused by load fluctuations, sudden current changes or changes in switching frequency. So during the operation of the IPM module, the fast response of NTC can assist it in detecting early temperature abnormalities in time, avoiding problems such as insulation aging and device failure caused by local overheating, providing temperature warnings for the module, and ensuring the efficient operation of IPM under complex working conditions.
2. Small dimension, adapting to the integrated design requirements of IPM module
The small dimension structure of EXSENSE bare chip allows it to be flexibly embedded in the compact encapsulated space of IPM module without occupying too much space, which is in line with the development trend of improving the integration of IPM module. At the same time, the heat conduction time of the small-dimension NTC die structure is short, which further improves the response speed of temperature monitoring.
As the core component of the IPM module, the application value of EXSENSE silver termination NTC chip runs through the entire life cycle of IPM design, production and operation, and is the key foundation to ensure its reliability and stability. From a technical point of view, the excellent electrical characteristics of EXSENSE bare chip accurately matches the strict requirements of IPM module for temperature monitoring and over-temperature protection. From the applied point of view, the sensitivity of EXSENSE silver termination NTC chip to temperature helps IPM module effectively prevent serious failures such as IGBT breakdown and insulation failure caused by overheating, extend the service life of IPM module.
